The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reactionYU, D. Q; WANG, L.Journal of alloys and compounds. 2008, Vol 458, Num 1-2, pp 542-547, issn 0925-8388, 6 p.Article

Tonkinecin, a novel bioactive annonaceous acetogenin from Uvaria tonkinesisCHEN, Y; YU, D. Q.Journal of natural products (Print). 1996, Vol 59, Num 5, pp 507-509, issn 0163-3864Article

Photoluminescence investigation of ZnO:P nanoneedle arrays on InP substrate by pulsed laser depositionYU, D. Q; HU, L. Z; LI, J et al.Applied surface science. 2009, Vol 255, Num 8, pp 4430-4433, issn 0169-4332, 4 p.Article

Stability of AuSn eutectic solder cap on Au socket during reflowYU, D. Q; OPPERMANN, H; KLEFF, J et al.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 1, pp 55-59, issn 0957-4522, 5 p.Article

Electrochemical migration of Sn-Pb and lead free solder alloys under distilled waterYU, D. Q; JILLEK, W; SCHMITT, E et al.Journal of materials science. Materials in electronics. 2006, Vol 17, Num 3, pp 219-227, issn 0957-4522, 9 p.Article

Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping methodYU, D. Q; WU, C. M. L; LAW, C. M. T et al.Journal of alloys and compounds. 2005, Vol 392, pp 192-199, issn 0925-8388, 8 p.Article

Microstructural evolution of Sn-9Zn-3Bi solder/Cu joint during long-term aging at 170 °CDUAN, L. L; YU, D. Q; HAN, S. Q et al.Journal of alloys and compounds. 2004, Vol 381, pp 202-207, issn 0925-8388, 6 p.Article

Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-Re lead-free solder alloys : Phase stability, formation and transformation of electronic materialsLAW, C. M. T; WU, C. M. L; YU, D. Q et al.Journal of electronic materials. 2006, Vol 35, Num 1, pp 89-93, issn 0361-5235, 5 p.Conference Paper

The formation of none-Ag₃Sn particles on the intermetallic compounds during wetting reactionYU, D. Q; WANG, L; WU, C. M. L et al.Journal of alloys and compounds. 2005, Vol 389, pp 153-158, issn 0925-8388, 6 p.Article

Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrateYU, D. Q; XIE, H. P; WANG, L et al.Journal of alloys and compounds. 2004, Vol 385, pp 119-125, issn 0925-8388, 7 p.Article

The wettability and microstructure of Sn-Zn-RE alloysWU, C. M. L; LAW, C. M. T; YU, D. Q et al.Journal of electronic materials. 2003, Vol 32, Num 2, pp 63-69, issn 0361-5235, 7 p.Article

Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloysWU, C. M. L; YU, D. Q; LAW, C. M. T et al.Journal of electronic materials. 2002, Vol 31, Num 9, pp 928-932, issn 0361-5235Article

Electromigration performance of Through Silicon Via (TSV): A modeling approachTAN, Y. C; TAN, C. M; ZHANG, X. W et al.Microelectronics and reliability. 2010, Vol 50, Num 9-11, pp 1336-1340, issn 0026-2714, 5 p.Conference Paper

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elementsWU, C. M. L; YU, D. Q; LAW, C. M. T et al.Journal of electronic materials. 2002, Vol 31, Num 9, pp 921-927, issn 0361-5235Article

Improvement of wettability and tensile property in Sn-Ag-Re lead-free solder alloyWANG, L; YU, D. Q; ZHAO, J et al.Materials letters (General ed.). 2002, Vol 56, Num 6, pp 1039-1042, issn 0167-577X, 4 p.Article

A dimeric stilbene from Gnetum parvifoliumLIN, M; LI, J. B; LI, S. Z et al.Phytochemistry. 1992, Vol 31, Num 2, pp 633-638, issn 0031-9422Article

Isolation and structure elucidation of ArmillaricinYANG, J. S; CHEN, Y. W; FENG, X. Z et al.Planta medica. 1989, Vol 55, Num 6, pp 564-565, issn 0032-0943Article

Isolation and structures of two new sesquiterpenoid aromatic esters: armillarigin and armillarikinYANG, J. S; SU, Y. L; WANG, Y. L et al.Planta medica. 1989, Vol 55, Num 5, pp 479-481, issn 0032-0943Article

Fabrication and characteristics of N-doped β-Ga₂O₃ nanowiresLIU, L. L; LI, M. K; YU, D. Q et al.Applied physics. A, Materials science & processing (Print). 2010, Vol 98, Num 4, pp 831-835, issn 0947-8396, 5 p.Article

Structural evolution during crystal nucleation in supercooled liquids with icosahedral short-range orderYU, D. Q; CHEN, M; YANG, H et al.Philosophical magazine letters. 2009, Vol 89, Num 1, pp 44-50, issn 0950-0839, 7 p.Article

Electrochemical migration of lead free solder jointsYU, D. Q; JILLEK, W; SCHMITT, E et al.Journal of materials science. Materials in electronics. 2006, Vol 17, Num 3, pp 229-241, issn 0957-4522, 13 p.Article

Properties of lead-free solder alloys with rare earth element additionsWU, C. M. L; YU, D. Q; LAW, C. M. T et al.Materials science & engineering. R, Reports. 2004, Vol 44, Num 1, pp 1-44, issn 0927-796X, 44 p.Article

A new bislabdane-type diterpenoid from the roots of Cunninghamia lanceolataJIANG DU; CHEN, R.-Y; YU, D.-Q et al.Journal of natural products (Print). 1999, Vol 62, Num 8, pp 1200-1201, issn 0163-3864Article

Polyoxygenated cyclohexenes from Uvaria grandifloraPAN, X.-P; CHEN, R.-Y; YU, D.-Q et al.Phytochemistry. 1998, Vol 47, Num 6, pp 1063-1066, issn 0031-9422Article

Two epimeric pairs of C-4-acetyl Annonaceous acetogenins from Goniothalamus donnaiensisZHONG JIANG; CHEN, R.-Y; YING CHEN et al.Planta medica. 1998, Vol 64, Num 4, pp 362-366, issn 0032-0943Article